CH-VLP/低輪廓銅箔

通過特殊的原箔生產工藝與后處理處理工藝，調整銅箔的微細結構，如晶粒大小、分布、 結晶位向及分布的狀態，來降低銅箔輪廓度，降低PCB端產品應用中信損，拓展PCB端產品 應用領域。/The profile of copper foil can be reduced by adjusting the fine structure of copper foil, such as grain size, distribution, crystal orientation and distribution, through special raw foil production process and post- treatment process, so as to reduce the loss of PCB end products and expand the application field of PCB end products.
? 在銅箔與基板的交接接口上，不會在蝕刻后發生殘留的銅粉(銅粉轉移現象)，提高了 PCB 的表面電阻和層間電阻特性，提高了介電性能的可靠性。/At the interface between copper foil and substrate, there will be no residual copper powder (copper powder transfer phenomenon) after etching, which improves the surface resistance and interlayer resistance characteristics of and improves the reliability of dielectric properties.
? 在多層板壓制成形后，較為平坦，適用于精線線路制作。/After the multilayer plate is pressed and formed, it is flat and suitable for fine line making.

產品/技術優勢/Advantages of Product/ Technology

? 優良的熱穩定性/Excellent thermal stability
? 高硬度，低輪廓度/High hardness, low profile
? 等軸結晶層特征，具有優良的常溫與高溫抗拉延伸/Characteristics of equiaxed crystalline layer with excellent tensile extension at room and high temperature
? PCB端信損小，特性阻抗控制優良/Small PCB end loss, Excellent characteristic impedance control

產品/技術應用范圍Application Area(s) of Product/ Technology

5G通訊等電子信息產業發展高速印制電路板/5G Communications and Electroni9c Information Industry Development of High Speed Printed Circuit Boards

 代表特性數據/Representive date