CH-HTE/高溫高延伸率電解銅箔

通過對傳統的原箔電鍍工藝進行改良，生產出高溫高延伸率電解銅箔，具有優良的常溫與 高溫性能，具有優良的高耐折特性，并且經過后處理后保留優良的結合力。/By improving the traditional original foil electroplating process, high temperature and high elongation electrolytic copper foil is produced, which has excellent properties at room temperature and high temperature, excellent folding resistance, and excellent adhesion after post-treatment.

? 適用于高密度互連技術板與柔性電路板/Suitable for HDI and FPC PCB.

產品/技術優勢/Advantages of Product/ Technology

? 優異的高溫延伸率/Excellent high temperature elongation
? 優良的高耐折特性/Excellent folding resistance
? 較低的粗糙度/Lower roughness
? 優良的基材結合力/Excellent substrate adhesion

產品/技術應用范圍Application Area(s) of Product/ Technology

單面板、雙面板、以及所有FR-4、CEM-1、CEM-3種類的基板/single-sided, double-sided PCB, and FR-4、CEM-1、CEM-3 substrate

代表特性數據/Representive date