CH-RTF/反轉銅箔

通過特殊的表面處理工藝，將電解銅箔S面進行精細瘤化處理，有效降低銅箔與基材接觸面 的輪廓，降低PCB端產品應用中的電信號損失，可應用5G高頻高速領域。/Through the special 

post-treatment process, the electrolytic copper foil S surface is coarsened and solidified to reduce the profile of the contact surface between the copper foil and the substrate, to 

reduce the letter loss in the application of the PCB end product, and to expand the application field of the PCB end product.
? 銅箔與基材結合面輪廓度低，PCB端蝕刻出現殘銅導致短路狀況改善明顯，并且微蝕速度提 升。/Copper foil and substrate surface profile is low, PCB end etching residual copper 

leads to obvious improvement of short circuit, and micro corrosion speed.
? PCB端銅箔M面可直接貼附干膜，不需要太多處理即可有良好的結合力，降低PCB端斷路風 險。/The M surface of PCB copper foil can be directly attached to the dry film, without too 

much treatment, it can have good adhesion and reduce the risk of open circuit of PCB .

產品/技術優勢/Advantages of Product/ Technology

良好的高溫延伸率/Good high temperature elongation
? 改善PCB端斷路、短路異常/Improvement of open & short problems in PCB .
? 微蝕速度提升，具有良好的蝕刻因子/The micro etching speed is increased and the etching factor is effective.
? 信損低/Low signal loss
? 多種規格型號供客戶選擇/Various specifications and models for customer selection

產品/技術應用范圍Application Area(s) of Product/ Technology

5G通訊等電子信息產業發展高速印制電路板/5G Communications and Electroni9c Information Industry Development of High Speed Printed Circuit Boards

 代表特性數據/Representive date